Sub micron

美 [sʌb ˈmaɪkrɑːn]英 [sʌb ˈmaɪkrɒn]
  • 网络亚微米;次微米
Sub micronSub micron
  1. Micron , Sub micron and Deep - Sub micron CMOS Process Technology Study

    微米、亚微米及深亚微米CMOS工艺技术研究

  2. Several considerations in overall design of sub micron stepper

    亚微米分步重复投影光刻机总体设计考虑的几个问题

  3. Control and algorithm investigation on temperature compensation of sub micron projection lithography objective

    亚半微米光刻投影物镜温度补偿控制及算法研究

  4. Standard sub micron grade for solid rotary tool applications .

    是适用于可转位工具的晶粒度为亚微米级的标准牌号。

  5. A Whole Chip ESD Protection Design Technology for Deep Sub micron CMOS IC

    深亚微米CMOSIC全芯片ESD保护技术

  6. Special ultra fine sub micron grade for high speed milling especially for mould making .

    特别适合高速铣削的晶粒度为超细的牌号,特别适合模具制造。

  7. Development of Sub micron Process Flows

    亚微米工艺流程研究

  8. Practical Cascade Stage Current Mirrors for Sub Micron Analog VLSI

    用于亚微米模拟VLSI中的实用串级电流镜电路

  9. The analysis and design of three main specifications ( resolution , overlay and throughput ) and technology methods taken in the sub micron stepper are described .

    介绍对亚微米分步重复投影光刻机光刻工作分辨力、套刻和生产能力三项主要技术指标的设计分析,方案考虑以及采取的技术措施。

  10. This paper presented the various technologies in RF design and explored the feasibility and difficulties of deep sub micron CMOS RF design . And problems associated are also discussed .

    本文介绍了当今RF设计的主流工艺,并分别对基于硅的深亚微米CMOS工艺在RF设计中的可行性和困难进行了研究,评述了其中存在的问题。

  11. The experiments Scanning electron microscopy ( SEM ) reveals that the grain sizes of the film were in sub micron meters but not uniform and .

    扫描电镜(SEM)表明CdS晶粒为亚微米尺寸。

  12. In this paper , several cascade stage current mirrors for sub micron analog VLSI have been improved and three useful circuits have been designed with PSpice 4 03 software .

    对亚微米模拟VLSI中使用的电流镜电路进行了改进。借助于PSpice4.03软件设计了几个实用的电流镜电路。

  13. The constitution of the control system for laser positioning stage used in sub micron E beam exposure machine and the design of PID positioning and control system for automatic correction of the stage are presented in the paper .

    系统介绍了亚微米电子束曝光机激光工件台控制系统的结构组成以及工件台自校正PID定位控制系统的设计。

  14. With the IC technology level entering the very deep sub micron era , signal integrity problem is increasingly serious . The quality of the power grid design is one of the most important factors impacting the signal integrity .

    自从集成电路加工工艺进入超深亚微米时代以后,芯片的信号完整性问题变得越来越严重,电源网格的设计质量是影响信号完整性的重要因素之一。

  15. The development of the Ultra Deep Sub Micron technique brings the integrated circuit to a new epoch of VLSI . The efficient utilization of the increased transistors in a single chip is a hot field of computer architecture researches .

    超深亚微米工艺的发展使集成电路进入了高度集成时代,高效合理地利用单个芯片上不断增加的晶体管成为计算机体系结构研究的一个热点。

  16. A novel technique has been developed to achieve sub micron etching of silicon nitride films with the plasma of CF 4 and O 2 gas mixture generated by a lab made electron cyclotron resonance ( ECR ) .

    在一台自行研制的电子回旋共振(ECR)刻蚀系统中用CF4、O2气体实现了Si3N4材料的微细图形刻蚀。

  17. It is found that optimization of the structure parameters of ridge waveguide ( RWG ) can decrease the threshold current of RWG laser diode . The way to get the device with sub micron ridge width is proposed .

    通过优化脊形波导的结构参数可以降低脊形波导激光器的阈值电流,提出了实现亚微米脊宽,从而降低阈值电流的方法。

  18. The machining accuracy requirement on ceramic interface for fibre optics is up to micron and sub micron orders , e.g. coaxality of the cylinder and the bore of interface is 1 μ m and roundness is 0.5 μ m.

    陶瓷光纤接口要求外圆与内孔的同轴度1μm、圆度5μm,加工精度达微米级和亚微米级。

  19. Based on the hydrodynamic energy transport model , the influence of the channel doping density on the performance for the deep sub micron grooved gate PMOSFET is studied using the two dimensional device simulator MEDICI and compared to that of the counterpart conventional planar device .

    利用二维器件仿真软件MEDICI,基于动力学能量输运模型对沟道掺杂浓度不同的深亚微米槽栅PMOSFET的特性进行了研究,并与相应平面器件的特性进行了对比。

  20. Study of Deep Sub - micron Flying Height Measuring Technology

    深亚微米飞行高度测量技术研究

  21. The positioning accuracy of sub - micron order is obtained .

    系统取得了亚微米级的定位精度,对超精密加工具有实用价值。

  22. Wireless Power Management Systems in Ultra - Deep Sub - Micron CMOS

    采用超深亚微米CMOS的无线电源管理系统

  23. Design of a deep sub - micron full differential sample / hold circuit

    深亚微米全差分采样/保持电路设计

  24. Optimization of Standby Power in Deep Sub - micron Integrated Circuit s

    深亚微米集成电路静态功耗的优化

  25. Diffraction Characteristics of Sub - micron Gratings for Light Guide Plate

    用于光导板的亚微米光栅衍射特性研究

  26. Deep ? Sub ? Micron Optical Lithography Process Technology

    深亚微米光学光刻工艺技术

  27. Research on Sub - micron Heavy CaCO_3 by Surface Modification

    亚微米重质碳酸钙的表面改性研究

  28. New Structures Used for ESD Protection of Sub - Micron CMOS IC 's

    亚微米CMOS集成电路ESD保护新结构

  29. Shallow Trench Isolation Process for Deep Sub - Micron Technologies

    深亚微米隔离技术&浅沟槽隔离工艺

  30. An Experimental Study on Separation of Sub - micron Particle From Liquid Phase by Centrifuge

    亚微米颗粒的离心沉降实验研究